Glass,Display

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microSHAPE

Laser Micromachining Systems for
Processing Glass and Sapphire

3D-Micromac‘s microSHAPETM FSLA laser system은 *FSLATM (Flow Supported Laser Ablation) 기술을 통해Glass 또는
Sapphire 기반의 Sample을 높은 정확도로 Drilling 하거나 Structuring 하는데 적합한 장비 입니다. 고도의 Laser flexible system을 통해 Glass 또는
Sapphire wafer를 2인치에서 8인치 까지 처리할 수 있으며, Display glasses의 bore holes, micro channel 뿐만 아니라 복잡한 마이크로 단위의
구조물까지 우수한 품질로 공정 가능한 장비입니다.

microSHAPE FSLA offers

  • Integration of picosecond or femtosecond laser source
  • Various optical setups suitable for glass processing
  • Up to 2 parallel beam paths for simultaneous processing
  • Quick change of work piece clamping unit
  • User-friendly, flexible, upgradeable system control

microSHAPE - System Configuration

Substrate size
  • · Wafer size 2’’ - 8’’
  • · Rectangular substrates up to 400 X 200mm
Laser Sources · ps laser source (532nm) in standard configuration
Beam delivery unit
  • · Beam path for 532 nm
  • · High dynamic 2D galvo scanner
Positioning system
  • · X-Y positioning system
  • · Optical z-axis for high drilling speed
  • · Travel distance 400mm X 200mm
  • · Positioning accuracy ± 0.002mm
  • · Repeatability ± 0.001mm
working area
· One wirjubg area :
· Wafer size 2’’ - 8’’
· Rectangular glass sheets : 400 X 200mm
· Two working areas :
· Wafer size 2’’ - 8’’
· Rectangular glass sheets : 200 X 200mm
  • · Customized Chucks depending on substrate size
Alignment
  • · Manual, semi-autimated or fully-automated work piece alignment with XY system and optical measure ment system available
  • · Automatic Z positioning
Softwar microMMI™
  • · Control and supervise of all hardware components and machining parameters
  • · Different user levers (administrator, supervisor, operator)
  • · Data input file types : DXF, CSV, Gerber, CLI, otehrs on request
Safety
  • · Laser class 1 housing with integrated control panel
  • · Certified laser window or overview camera (webcam)
  • · Active exhaust system included
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