Semiconductor, Wafer

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Roll-to-Roll System for Processing
of Flexible Substrates

3D-Micromac‘s highly versatile microFLEX™ 은 photovoltaics, electronics, medical devices, displays, and semiconductors 등
Flexible thin fims의 제조공정에 적합한 All-in-one solution 장비입니다. 본 장비는 정밀 가공 Laser 기술을 통해 cleaning, coating, printing 그리고
packaging technologies 뿐만 아니라 inline 공정에서도 높은 품질을 제공합니다. 또한 고객의 요청에 따라 다양한 customized solution이 제공되며
산업용 대량 생산 Pilot lines 까지 적용 가능합니다.

microFLEX offers

  • Laser processing on-the-fly or in step and repeat mode
  • Integration of different laser sources and wavelengths
  • Various optical setups, e.g. galvo scanner, fixed optics, and line beam set-up
  • Highest precision in web control: down to ± 1 μm tracking error
  • Machining under ambient conditions, inert gas atmosphere or vacuum
  • User-friendly, flexible system control including MES
  • Roll-to-roll or roll-to-sheet configurations
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